Chengdu, a vibrant hub city in the west, is about to usher in the annual industrial technology event of 2025! As the industry's leading industrial computer system platform solutions expert, Special Control is ready to bring its latest products and technical solutions to the 2025 Chengdu International Industry Expo. Sincerely invite you to come to the scene, learn the charm of innovation, and look forward to a new chapter of intelligent manufacturing!

New Arrivals

Modular BOXPC:MBOX-TM

Modular series BOXPC is based on highly integrated design architecture, providing customized hardware solutions for complex application scenarios with multiple network ports, multiple serial ports and multiple 1/0 interfaces. The product adopts fanless thermal conduction heat dissipation design, which greatly enhances the stability of the equipment in harsh industrial environments, and can be operated continuously and stably in high and low temperatures, dusty and other complex working conditions. Perfectly suited to the visual inspection, industrial control, photovoltaic energy, power security and other industrial applications, can be seamlessly integrated into various industrial systems.

The hardware platform is equipped with Celeron J1900 to Core 13 processors, which can meet the diverse arithmetic needs from edge data collection to complex industrial algorithm processing with its powerful computing capability.

Low Power Compact Fanless Industrial Controller:MEC-T6442-032L

This product is a high-performance modular embedded energy-efficient industrial controller for automation, machine gauging and other industries, supporting the Intel Celeron J6412.The product shell is made of aluminum alloy die-casting one-piece molding, with an embedded fan assisting in heat dissipation, to ensure the product's excellent heat dissipation and ruggedness, and the fully-enclosed design prevents the intrusion of dust, while fully taking into account the stability of the heat dissipation. At the same time, the stability of heat dissipation is also fully taken into account.

The hardware and structure of the product adopts the mature modular design scheme, which ensures the stability of the product and the cost of maintenance and upgrading is well controlled in the later stage. Can be widely used in 3C semiconductor, pharmaceutical, packaging, mechanical testing equipment, robotics, motion control, intelligent transportation and other fields.